Backplanes or Backpanels are complex, multi-layer printed circuit boards used to connect racks of other boards in an electronics rack or enclosure.

Blind or Buried Vias are small holes which interconnect inner layers of high layer-count printed circuit boards.

Build To Order (BTO) is a service that starts or completes a specific product unit’s manufacturing and configuration once an individual order has been placed. This is in contrast to building and stocking product to a forecast and selling to customers from finished goods stock.

Burn-In Testing is a thermal test method where products are powered on for extended periods to ensure product functionality.

BUS are the electrical connections between various integrated circuits and peripheral semiconductors.