Micro Ball Grid Array is a method of mounting an integrated circuit or other component to a higher layer-count printed circuit board with an array of extremely small solder balls (or columns) at each contact, allowing for greater component density.

Microprocessors are integrated circuits that contain the entire central processing unit for a computing device, which reads and performs software instructions from a separate memory source.

Microvias are small holes, or vias, generally created with lasers employing depth control, rather than mechanical drills, through which multilayered printed circuit board traces interconnect components.

Multichip Module Laminates are a type of printed circuit board design that allows for the placement of multiple integrated circuits or other components in a limited surface area.